Making and testing an integrated circuit using high density probe points
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United States of America Patent
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Jul 6, 1993
Issued Date -
N/A
app pub date -
Oct 11, 1991
filing date -
May 16, 1988
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Individual transistor or logic unit testing is accomplished by a specially fabricated flexible tester surface made in one embodiment of several layers of flexible silicon dioxide, each layer containing vias and conductive traces leading to thousands of microscopic metal probe points on one side of the test surface. The probe points electrically contact the contacts on the wafer under test by fluid pressure.
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