Dry contact electroplating apparatus
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United States of America Patent
Stats
-
Jul 13, 1993
Grant Date -
N/A
app pub date -
Jun 12, 1992
filing date -
Jun 12, 1992
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A dry contact electroplating structure is disclosed. The structure includes a base member for immersion within an electroplating solution. The base member has a central aperture defined by an aperture perimeter formed within the base member. A sealing ring is positioned adjacent to the aperture perimeter. The sealing ring forms a sealing connection with an object to be electroplated. A number of electrical contacts are positioned adjacent to the sealing ring. The electrical contacts form an electrical connection with one side of the object to be electroplated. A lid is positioned on the base member over one side of the central aperture. Thus, the lid protects the electrical contacts and one side of the object to be electroplated, while the other side of the object is exposed to the electroplating solution.
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