Tungsten metallization

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United States of America Patent

PATENT NO 5227335
SERIAL NO

07517973

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The adhesion of tungsten to an underlying dielectric layer is improved by the use of a thin glue layer of either TiN or Al.

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Patent Owner(s)

  • AGERE SYSTEMS INC.;AT&T BELL LABORATORIES;BELL TELEPHONE LABORATORIES, INCORPORATED

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Holschwandner, Lowell H Fountain Hill, PA 1 27
Rana, Virendra V S South Whitehall Township, Lehigh County, PA 28 1089

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