Method of manufacture of a thermal inkjet thin film printhead having a plastic orifice plate
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United States of America Patent
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Jul 20, 1993
Grant Date -
N/A
app pub date -
Nov 8, 1990
filing date -
Nov 8, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of manufacture of a thermal inkjet printhead having a plastic orifice plate which comprises the steps of providing a dummy substrate upon which the printhead may be constructed, and then forming a plastic orifice plate member on top of the dummy substrate. Then, an insulating barrier layer is formed on the surface of the plastic orifice plate and is provided with a plurality of firing chambers therein which are aligned, respectively, with orifice openings in the plastic orifice plate. Next, a thin film resistor substrate is deposited on an exposed surface of the barrier layer and is provided with a plurality of individually defined heater resistors which are aligned, respectively, with the firing chambers in the barrier layer. Finally, the dummy substrate is removed from the composite structure using photoresist lift off techniques.
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