Method of using a contamination shield during the manufacture of EPROM semiconductor package windows
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United States of America Patent
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Jul 27, 1993
Issued Date -
N/A
app pub date -
Aug 3, 1992
filing date -
Dec 7, 1990
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A protective shield is provided on the UV transparent window of a ceramic lid for a EPROM integrated circuit package so as to prevent accumulation of foreign particulate matter thereon during the manufacture of the package.
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