Method of sealing electric parts mounted on electric wiring board with resin composition
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United States of America Patent
Stats
-
Aug 3, 1993
Grant Date -
N/A
app pub date -
Dec 10, 1990
filing date -
Dec 11, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of sealing electric parts mounted in a bare state on an electric wiring board uses a liquid sealing resin as a printing ink and a screen serving as screen printing means and having apertures in the same pattern as the electric parts mounted on the board. The lower end of a peripheral wall of the screen defining each of the apertures is substantially brought into line-to-line contact with the surface of the board for screen printing. The screen has a recess formed on the rear side of the line contact portion thereof and surrounding the contact portion. These features prevent the printing ink from adhering to the rear side of the screen and the collapse of the sealing resin layer that would occur if the ink adheres to the screen rear sides.
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