Method for forming perforations on a printed circuit board
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United States of America Patent
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-
Aug 10, 1993
Grant Date -
N/A
app pub date -
Jun 26, 1991
filing date -
Jun 26, 1990
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method for forming perforations on a printed circuit board by means of press-working is disclosed. The perforations are used to facilitate the separation of a mother portion from the supplementary portions of a printed circuit board. The method is characterized in that the surface area of one side or both sides of the printed circuit board to be perforated is coated with copper film prior to the formation of the perforations in order to prevent cracks from forming around the perforations.
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