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Abstract

A microaccelerometer package is provided for use in on-board automotive safety control and navigational systems. The microaccelerometer package is constructed so as to minimize the influence of extraneous mechanical stress and vibrational resonance on the micromachined accelerometer. The microaccelerometer package includes a rigid housing in which there is a cavity for receiving the micromachined accelerometer unit and the signal-processing circuitry. The lower surface of the cavity is interrupted by a recess projecting below the plane of the lower surface. The micromachined accelerometer unit is secured within the recess so as to be below the plane of the lower surface. The signal-processing circuitry is supported by a substrate which is secured to the lower surface of the cavity. One edge of the substrate, on which are disposed a number of wire bond sites, partially projects over the accelerometer unit within the recess, but no further than a corresponding number of wire bond sites on the micromachined accelerometer unit. Electrically interconnecting the wire bond sites of the signal-processing circuitry and the micromachined accelerometer unit are a corresponding number of electrical conductors.

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First Claim