Plasma cutting device
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United States of America Patent
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-
Aug 10, 1993
Grant Date -
N/A
app pub date -
Oct 4, 1990
filing date -
Oct 23, 1989
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The plasma cutting device of the present invention comprises a plurality of release ports for releasing the work gas to prevent adverse influence on the cutting processing besides the exhaust port for jetting the gas toward the work. Accordingly the flow rate and velocity of the swirl flow are increased and the flow rate of the jet gas is still kept the same as that in the conventional device, resulting in stabilizing the plasma arc and performing superior cutting.
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