Rework of polymeric dielectric electrical interconnect by laser photoablation
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 17, 1993
Issued Date -
N/A
app pub date -
Nov 6, 1992
filing date -
May 10, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A metal/polymeric dielectric substrate has metal conductors selectively disconnected by photoablating the polymeric dielectric with an excimer laser, etching the exposed metal using the polymeric dielectric as a mask, and coating an additional layer of polymeric dielectric. This eliminates the need for depositing and removing a separate photoablatable mask. Siloxane-modified-polyimide is a preferred photoablatable polymeric material and copper is a preferred metal.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully