Thermoplastic semiconductor package and method of producing it
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United States of America Patent
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Aug 31, 1993
Issued Date -
N/A
app pub date -
Nov 17, 1992
filing date -
Nov 2, 1990
priority date (Note) -
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Abstract
A semiconductor package includes a lead frame with a die or chip mounted on a die pad, a base made of a thermoplastic material and having a cavity, and a lid made of thermoplastic material ultrasonically welded to the base to cover the cavity and protect the electronic device in the package. The package may include a substrate with conductive traces. A method of attaching a lid to a semiconductor package base includes the steps of providing a semiconductor package base having an open cavity, providing a thermoplastic lid that covers the open cavity, placing the lid on the semiconductor package base so that the lid covers the open cavity, applying pressure to hold the lid and body together, and attaching the lid to the base by ultrasonically welding them together.
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