Leadless pad array chip carrier
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Aug 31, 1993
Issued Date -
N/A
app pub date -
Nov 16, 1992
filing date -
Dec 21, 1990
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A leadless pad array chip carrier package is disclosed, employing a printed circuit board (22) having an array of solder pads (34) on the bottom side. A semiconductor device (24) is electrically wire bonded (49) and attached with conductive adhesive (47) to the metallization patterns (43, 25) of the printed circuit board (22). A protective plastic cover (26) is transfer molded about the semiconductor device (24) covering substantially all of the top side of the printed circuit board (22).
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