Method of making a positive temperature coefficient device
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United States of America Patent
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Sep 7, 1993
Grant Date -
N/A
app pub date -
Jul 10, 1992
filing date -
Jul 12, 1991
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A positive temperature coefficient ('PTC') device body is formed by compression molding of an organic PTC composition consisting of a crystalline polymer with conductive particles dispersed therein. The body is sandwiched between electrodes to which terminals are attached by spot welding or soldering. The PTC device body is aged at normal pressure and at a temperature higher than the peak resistance temperature, that is, the temperature at which its resistance is a maximum, and lower than 250.degree. C. The resistance of the PTC device does not change either before or after exposure to high temperatures, that is, temperatures substantially greater than 250.degree. C., and the PTC characteristics of the device do not decrease despite aging. Therefore PTC devices made according to the present invention can be surface-mounted.
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