Lead-free alloy containing tin, zinc and indium

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United States of America Patent

PATENT NO 5242658
SERIAL NO

07909694

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Abstract

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A low melting point solder alloy comprising effective amounts of tin, zinc and indium.

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Patent Owner(s)

Patent OwnerAddress
INDIUM CORPORATION OF AMERICA THE A CORP OF NY1676 LINCOLN AVENUE UTICA NY 13502

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Stevens, Laurence G Clinton, NY 2 20
White, Charles E T Clinton, NY 5 95

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