Ceramic chip carrier with lead frame or edge clip
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United States of America Patent
Stats
-
Sep 7, 1993
Grant Date -
N/A
app pub date -
Feb 18, 1992
filing date -
Feb 18, 1992
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A ceramic chip carrier is disclosed which includes a ceramic substrate having a circuitized surface, at least one semiconductor chip mounted on the circuitized surface, and a lead frame or edge clip which is mechanically and electrically connected to contact pads on the circuitized surface. Each mechanical/electrical connection between the lead frame or edge clip and the contact pads includes a conventional solder connection. In addition, each such solder connection is at least partially encapsulated in a material, including an epoxy resin, which is chosen in relation to the solder connection to enable the solder connection to withstand a standard thermal fatigue test.
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