Electroplating of superconductor elements
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United States of America Patent
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Sep 14, 1993
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app pub date -
Jun 2, 1992
filing date -
May 6, 1991
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Abstract
Processes and techniques are described for concurrent electroplating of yttrium, barium and copper from aqueous solution onto a desired substrate (e.g., nickel, nichrome or silver). Compounds of these elements are dissolved in solution and then placed in a plating cell in which the cathode is the substrate on which the elements are to be deposited. After the elements have been deposited, they are oxidized to provide the desired perovskite structure. The process may be continuous or non-continuous.
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