Tool for use with tweezer handpiece for installation and removal of electronic components with respect to a substrate
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United States of America Patent
Stats
-
Sep 21, 1993
Issued Date -
N/A
app pub date -
Jun 22, 1992
filing date -
Jun 5, 1991
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A tweezer-type heating device for installation and removal device of electronic components with respect to a substrate, such as for SMC installation and through hole installation or removal. More specifically, a handheld tweezer-type heating device is provided in which a wide variety of different sized (and shaped) tips can be used with a high degree of accuracy in terms of thermo/mechanical contact. Tolerances in the parts of the handpiece, the assembly, the heaters and the tips that may bring the bottom edges of the tips out of their alignment plane are very easily corrected with an adjustable hinge which, by loosening of a screw and sliding the parts with respect to each other, allows proper alignment to be achieved. Still further, a thumb screw is provided at the back of the handpiece to allow the gap between the tips to be slightly opened or closed. This is useful in accommodating tolerances in the components. Also, it allows the operator to slip-fit the tips over the component and make proper thermo/mechanical contact with little or no squeezing of the handpiece, thereby minimizing the chance of mechanically damaging the component or its leads by squeezing too hard, or causing damage to adjacent components. A plate-like alignment tool with projecting tab portions that engages in an edge slot of the tip elements and contacts other surfaces of the tip elements, as well, enables simultaneous aligning of the tip elements axially, laterally and rotationally with respect to each other and the mounting units.
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
| Patent Owner | Address | |
|---|---|---|
| PACE INCORPORATED | LAUREL MD |
International Classification(s)
Inventor(s)
| Inventor Name | Address | # of filed Patents | Total Citations |
|---|---|---|---|
| Siegel, William J | Silver Spring, MD | 23 | 358 |
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Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|
| Fee | Large entity fee | small entity fee | micro entity fee |
|---|---|---|---|
| Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
| Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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