Bond inspection technique for a semiconductor chip
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United States of America Patent
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Sep 21, 1993
Grant Date -
N/A
app pub date -
Jun 1, 1992
filing date -
Jun 1, 1992
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A bond inspection technique which determines the integrity of a plurality of package leads (13) bonded to a plurality of contact areas (12) on a semiconductor chip (11). A bonding process heats each package lead (13) bonded to each contact area (12). A camera (16) forms an infra-red intensity image at a predetermined time of the semiconductor chip (11) and ports image data to a computer (18). Infra-red intensity radiated from each bond on the semiconductor chip (11) is compared by the computer (18) with infra-red intensity data of known good and bad bonds. The comparison of each bond determines bond integrity of the semiconductor chip (11).
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