Semiconductor heat removal apparatus with non-uniform conductance
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United States of America Patent
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Sep 21, 1993
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N/A
app pub date -
Jun 12, 1992
filing date -
Jun 12, 1992
priority date (Note) -
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Abstract
An apparatus for removing heat from a semiconductor is disclosed. The apparatus is a non-uniform thermal conductance structure which includes high thermal conductance regions and low thermal conductance regions. The apparatus is coupled to the semiconductor in such a manner that the high power density, and thus high temperature, regions on the semiconductor are aligned with the high thermal conductance regions of the apparatus, and low power density, and thus low temperature, regions on the semiconductor are aligned with the low thermal conductance regions of the apparatus. As a result, a desirable temperature profile may be established across the surface of the semiconductor.
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