Semiconductor pick-and-place machine calibration apparatus
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United States of America Patent
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Sep 28, 1993
Grant Date -
N/A
app pub date -
Oct 25, 1991
filing date -
Oct 25, 1991
priority date (Note) -
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Abstract
An apparatus and method of performing a calibration of the accuracy of placement of semiconductor chips or devices by a pick-and-place machine. The chips are placed on an adhesive-backed glass plate that has calibrated etch marks whose dimensions are chosen to aid the inspector in estimating, or carefully measuring in an optic comparator, the amount of placement error that the machine is causing. The calibration would be performed on a periodic basis as a preventive maintenance program.
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