Packaging architecture for a highly parallel multiprocessor system
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United States of America Patent
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Oct 5, 1993
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N/A
app pub date -
Jun 11, 1990
filing date -
Jun 11, 1990
priority date (Note) -
Expired
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Abstract
The present invention includes methods and apparatus for creating a packaging architecture for a highly parallel multiprocessor system. The packaging architecture of the present invention can provide for distribution of power, cooling and interconnections at all levels of components in a highly parallel multiprocessor system, while maximizing the number of circuits per unit time within certain operational constraints of such a multiprocessor system.
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