Process for producing multilayered printed board
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United States of America Patent
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-
Oct 12, 1993
Grant Date -
N/A
app pub date -
Jul 30, 1991
filing date -
Jul 30, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A process for producing a multilayered printed circuit board which comprises using, as an intermediate layer, an inner-layer board obtained by chemically oxidizing the surface of a copper foil constituting an outermost layer of an inner-layer board having a printed circuit formed in the copper foil, thereby to form on the surface a finely roughened layer constituted by a copper oxide of a brown to black color, and then reducing the copper oxide constituting the finely roughened layer in an atmosphere in which a reducing gas is present.
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