Semiconductor package
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United States of America Patent
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Oct 12, 1993
Grant Date -
N/A
app pub date -
Feb 10, 1992
filing date -
Feb 10, 1992
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor package is provided having a die attach flag (12) with integral flanges (13) which prevent high pressure plastic encapsulant (18) from escaping or entering between the die attach flag (12) and a mold cavity plate (15) during encapsulation. The die attach flag (12) is held flush against the cavity plate (15) by the packing pressure of the encapsulant (18) during low pressure stages of the encapsulation process. Plastic flowing along the flange (13) solidifies more rapidly than plastic in the body of the semiconductor package, thereby damming plastic flow at the edges of the die attach flag (12) during high pressure stages of the encapsulation process.
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