Heated plate rapid thermal processor
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United States of America Patent
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Oct 12, 1993
Issued Date -
N/A
app pub date -
Oct 23, 1991
filing date -
Jul 2, 1990
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A rapid thermal processor for heat treating and cooling semiconductor material in an elongated process chamber having a base, side and top walls which enclose a heater plate assembly through which thin pins longitudinally move to carry workpieces vertically to and from the heater assembly. A cooling shutter is adapted in the chamber to shield the workpiece from the heater plate when the cooling process takes place. The chamber has gaseous ambient control means which regulates the type of atmosphere or vacuum in the chamber during heat processing of the workpieces.
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