Apparatus for contouring a semiconductor, light responsive array with a prescribed physical profile
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United States of America Patent
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Oct 12, 1993
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N/A
app pub date -
Jan 27, 1992
filing date -
Jan 27, 1992
priority date (Note) -
Expired
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Abstract
Large area semiconductor wafers such as CCDs typically have a non-flat profile. A vacuum chuck is used to generate a vacuum under the chip to reduce the curvature to conform to the flat profile of the substrate surface through which the vacuum is generated. Other than flat final profiles are useful also.
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