Packaged semiconductor device having tab tape and particular power distribution lead structure
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Oct 12, 1993
Grant Date -
N/A
app pub date -
Sep 14, 1992
filing date -
Sep 19, 1991
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A packaged semiconductor device having an LOC structure, a thin body, and good electrical characteristics employs a TAB tape. A semiconductor chip carries ground pads arranged in a row, power pads arranged in another row, and signal pads arranged in two rows on both sides of the rows of ground and power pads. A shared ground lead and a shared power lead extend along and are connected to ground pads and power pads, respectively.
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