Lead frame having an anodic oxide film coating

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United States of America Patent

PATENT NO 5252855
SERIAL NO

07775549

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Abstract

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Lead frames, in which at least one part of the surface of a metal member which is a part of the lead frame is provided with an anodic oxide film of copper or a copper alloy, and in which a member composed substantially of a resin film or a resin plate is connected to the lead frame through this anodic oxide film by gluing or pressing under heat exhibit good adhesion between the metal member and the resin film or plate. Similarly, lead frames constructed with at least two metal members, having a portion of the surface provided with an anodic oxide film of copper or a copper alloy, and in which these metal members are joined together through this anodic oxide film exhibit good adhesion between the metal members.

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Patent Owner(s)

  • MITSUBISHI DENKI KABUSHIKI KAISHA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Noguchi, Hiroyuki Sagamihara, JP 49 648
Ogawa, Yoshiaki Sagamihara, JP 3 66

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