Stacked DCA memory chips
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United States of America Patent
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-
Oct 12, 1993
Grant Date -
N/A
app pub date -
Aug 5, 1991
filing date -
Aug 5, 1991
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A memory system package is provided by placing memory chips face-to-face using as an interposer a thin flexible carrier having through-carrier-connections, vias, for common memory chip I/O pads which are brought out to access external signals, either control, I/O or power. These external signals may also be wired to memory chip pads that are not common.
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