Method of securing semi-conductor wafer using retention clip
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United States of America Patent
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Oct 19, 1993
Issued Date -
N/A
app pub date -
Aug 14, 1992
filing date -
Nov 21, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A clip for removably securing a semi-conductor wafer to the treatment surface of a semi-conductor wafer processing pedestal. The clip is constructed with a pair of spaced apart, forwardly extending tines adapted to engage outer edges of a semi-conductor wafer supported upon the treatment surface. A clip tail is oppositely disposed from the tines and affords resilient movement of the tines toward and away from the edges of the pedestal treatment surface to enable the installation and removal of the wafer therefrom.
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