Method of fabricating integrated resistors in high density substrates
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United States of America Patent
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Oct 19, 1993
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app pub date -
Feb 24, 1992
filing date -
Oct 30, 1990
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Abstract
A process for fabricating integrated resistors in high density interconnect substrates for multi-chip modules. In addition, the resistor material can be converted selectively into an insulator for optionally allowing for the simultaneous fabrication of integrated resistors and capacitors in relatively few steps. The process is well suited for copper/polyimide substrates.
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