Ductile copper
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United States of America Patent
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-
Oct 26, 1993
Grant Date -
N/A
app pub date -
Aug 4, 1992
filing date -
Aug 4, 1992
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An improved method of manufacturing electrolessly deposited copper is described. The copper deposits are useful in the manufacture of fully additive and partly additive plated-through hole, printed wiring boards. The copper is deposited from a bath containing a copper compound, a complexing agent for copper, a reducing agent for copper, a pH-adjusting agent and one or more addition agents. The improvement for producing highly stress resistant, copper deposits comprises controlling one or more plating bath parameters such as pH, complexing agents and sources of iron or chromium, so that the trace iron and/or chromium in the deposited copper is less than 2 mg/mole of copper.
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