Screen printing method for forming a multiplicity of printed wiring boards
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United States of America Patent
Stats
-
Oct 26, 1993
Grant Date -
N/A
app pub date -
Mar 16, 1992
filing date -
Mar 20, 1991
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Method to form a photosensitive ink film having an even thickness over the entire surface of a broad plate material capable of obtaining a multiplicity of printed wiring boards. An emulsion pattern 4 is provided on a screen 3 on which a squeegee travels. The pattern 4 is formed correspondingly to a cutting spaces of a plate material for the purpose of obtaining a multiplicity of printed wiring boards. When a photosensitive ink is forced onto the broad plate material through a screen 3 for a screen printing, the photosensitive ink is dispersed by the pattern 4, thereby forming a film of even thickness over the entire surface of the plate material not corresponding to the emulsion pattern.
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