Plasma processing method and apparatus
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United States of America Patent
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Oct 26, 1993
Issued Date -
N/A
app pub date -
Oct 31, 1990
filing date -
Feb 5, 1988
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A plasma process and an apparatus therefor are described. A number of substrates are disposed between a pair of electrodes, to which a high frequency electric power is applied in order to generate glow discharge and induce a plasma. The substrates in the plasma are applied with an alternating electric field. By virtue of the alternating electric field, the substrates are subjected to sputtering action.
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