Shrink accommodating lead frame
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United States of America Patent
Stats
-
Oct 26, 1993
Grant Date -
N/A
app pub date -
Apr 15, 1992
filing date -
Apr 15, 1992
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A lead frame design which can be used with a number of different die sizes is described. To customize the lead frame, a punch excises an amount of lead finger material to form a void between the lead fingers for receiving a die. The amount of material removed is greater for larger sized die. A material, such as an adhesive tape, attaches the die to the lead frame. The bond pads on the die are then wire bonded to the lead fingers. The adhesive tape also locks the lead fingers into place, thereby preventing movement which could detach the bond wires from the die or lead frame.
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Cited Art Landscape
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