Method for manufacturing a semiconductor device using a circuit transfer film
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United States of America Patent
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Nov 2, 1993
Issued Date -
N/A
app pub date -
Feb 13, 1992
filing date -
Dec 31, 1990
priority date (Note) -
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Abstract
The invention relates to device processing, packaging and interconnects that will yield integrated electronic circuitry of high density and complexity. Processes include the formation of complex multi-function circuitry on common module substrates using circuit tiles of silicon thin-films which are transferred, interconnected and packaged. Circuit modules using integrated transfer/interconnect processes compatible with extremely high density and complexity provide large-area active-matrix displays with on-board drivers and logic in modules.
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