Semiconductor device encapsulant
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United States of America Patent
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Nov 2, 1993
Grant Date -
N/A
app pub date -
Feb 20, 1990
filing date -
Feb 23, 1989
priority date (Note) -
Expired
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Abstract
A semiconductor device encapsulant contains (a) a thermosetting resin for providing a cured product having a glass transition temperature of not less than 190.degree. C., (b) a filler consisting of a fused silica, (c) a modifier consisting of an MBS or ABS, (d) a modifier consisting of a silicone rubber or a silicone gel, and (e) a lubricant containing a metal chelate compound.
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