A thin film capacitor composed of a hybrid dielectric thin film that is sandwiched by a pair of electrodes. The hybrid dielectric thin film is obtained by complexing or accumulating first and second regions. The first region is derived from an ion plating source and the second region is derived from another ion plating source containing an auxiliary material to be coupled with the first region, both being obtained through an ion plating process. The use of the auxiliary material ensures a pinhole-free hybrid dielectric thin film.
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