Thin film capacitor and apparatus for manufacturing same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5258886
SERIAL NO

07900372

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A thin film capacitor composed of a hybrid dielectric thin film that is sandwiched by a pair of electrodes. The hybrid dielectric thin film is obtained by complexing or accumulating first and second regions. The first region is derived from an ion plating source and the second region is derived from another ion plating source containing an auxiliary material to be coupled with the first region, both being obtained through an ion plating process. The use of the auxiliary material ensures a pinhole-free hybrid dielectric thin film.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
C. ITOH FINE CHEMICAL CO., LTD.TOKYO2

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kashiwagi, Kunihiro Shiki, JP 3 24
Murayama, Yoichi 304, Domusu Mejiro, 17-44, Shimoochiai 3-chome, Shinjuku-ku, Tokyo, JP 17 84
Yoshida, Yasuhiko Saitama, JP 21 121

Cited Art Landscape

Patent Info (Count) # Cites Year
 
MICRON TECHNOLOGY, INC. (1)
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FUJI PHOTO FILM CO., LTD. (1)
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* Cited By Examiner

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
Other [Check patent profile for assignment information] (1)
* 5957090 Electrostatic pet hair remover 9 1998
 
QUALCOMM INCORPORATED (5)
* 8487400 High performance system-on-chip using post passivation process 1 2007
* 2008/0042,273 High performance system-on-chip using post passivation process 7 2007
* 2008/0042,239 High performance system-on-chip using post passivation process 5 2007
8384189 High performance system-on-chip using post passivation process 0 2008
* 2009/0001,511 High performance system-on-chip using post passivation process 3 2008
 
GENERAL ELECTRIC COMPANY (1)
* 7852611 High capacitance film capacitor system and method for manufacturing the same 1 2007
 
NANOPIERCE TECHNOLOGIES, INC. (1)
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NEXPERIA B.V. (1)
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INTARSIA CORPORATION (2)
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6486530 Integration of anodized metal capacitors and high temperature deposition capacitors 33 2000
 
Ultrasource, Inc. (11)
6761963 Integrated thin film capacitor/inductor/interconnect system and method 21 2001
6998696 Integrated thin film capacitor/inductor/interconnect system and method 8 2003
6890629 Integrated thin film capacitor/inductor/interconnect system and method 10 2003
* 2004/0081,811 Integrated thin film capacitor/inductor/interconnect system and method 15 2003
* 2004/0080,021 Integrated thin film capacitor/inductor/interconnect system and method 15 2003
7327582 Integrated thin film capacitor/inductor/interconnect system and method 6 2005
* 2005/0175,938 Integrated thin film capacitor/inductor/interconnect system and method 3 2005
7425877 Lange coupler system and method 1 2005
* 2005/0162,236 Lange coupler system and method 2 2005
7446388 Integrated thin film capacitor/inductor/interconnect system and method 6 2005
* 2006/0097,344 Integrated thin film capacitor/inductor/interconnect system and method 0 2005
 
TERAMIKROS, INC. (1)
RE41511 Semiconductor device having a thin-film circuit element provided above an integrated circuit 0 2007
 
KONINKLIJKE PHILIPS ELECTRONICS N.V. (1)
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GOOGLE TECHNOLOGY HOLDINGS LLC (1)
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INNOLUX CORPORATION (1)
* 2003/0031,001 Flat panel display and printed circuit board used therein 3 2002
 
CASIO COMPUTER CO., LTD. (2)
6870256 Semiconductor device having a thin-film circuit element provided above an integrated circuit 16 2002
* 2003/0038,331 Semiconductor device having a barrier layer 12 2002
* Cited By Examiner