Importance

Loading Importance Indicators...

Abstract

A wafer surface treatment apparatus and method used in the apparatus including a treatment tank with a cylindrical inside with a bottom, a circular recess formed in the bottom of the tank, a plurality of lower fluid holes opened in the recess, and a horizontally long opening provided at lower part of the side wall of the tank. A movable wall is tightly but slidably installed in the cylindrical inside of the tank so that the movable wall forms a closed room with the recess when it comes into contact with the bottom of the tank. Also, a plurality of upper fluid holes are provided so as to communicate with the closed room, and a rinsing water and washing liquid supply/discharge device is connected to the upper and lower fluid holes. Surfaces of a semiconductor wafer is treated by placing one wafer in the recess, closing the opening, and then spouting a fluid (washing liquid and rinsing water) onto the both sides of the wafer repeatedly while the wafer is floating and rotated by a spouting force of the fluid in the closed room. The fluid used in the treatment is discharged from the tank while the treatment is being performed.

Loading the Abstract Image...

First Claim