Method for bonding a lead to a die pad using an electroless plating solution
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United States of America Patent
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Nov 9, 1993
Issued Date -
N/A
app pub date -
Oct 9, 1991
filing date -
Dec 20, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An interconnect structure comprising an interconnection formed between a bond pad and the end of a lead. The layer includes nickel, copper, cobalt, palladium, platinum, silver or gold and is electrically conductive. Also, an apparatus for forming an interconnection by a metal plating process and a device having a lead, a substrate, and a bath containing an aqueous metal plating solution which permits formation of the interconnect structure. A method of forming an interconnect structure including the step of placing a lead adjacent to a bond pad and placing the two in an electroless plating solution so that the interconnect structure may be formed.
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