Multilayer circuit board for mounting ICs and method of manufacturing the same
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United States of America Patent
Stats
-
Nov 9, 1993
Grant Date -
N/A
app pub date -
Dec 13, 1991
filing date -
Apr 23, 1990
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A multilayer printed circuit board on which integrated circuit chips may be directly mounted has holes at predetermined locations, electrical connections between a chip and conductive layers of the circuit board being accomplished via the holes. The electrical connections are in the form of bump members which protrude outwardly from the circuit board. The bump members cooperate with an electrically conductive plating layer or filler that is in intimate contact with a conductive layer(s) exposed in the formation of each hole.
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Cited Art Landscape
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