Direct application of unpackaged integrated circuit to flexible printed circuit
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United States of America Patent
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Nov 16, 1993
Issued Date -
N/A
app pub date -
Aug 19, 1992
filing date -
Aug 19, 1992
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method is described for electrically connecting flip chips to a flexible printed circuit substrate. The method comprises (1) providing solder paste to a plurality of active contact pads located on the flexible printed circuit substrate, (2) placing the flip chips on the substrate such that solder bumps located on the flip chips are in registration with the solder paste on the active contact pads, and (3) heating the resulting assembly as a whole so that the solder paste on each active contact pad reflows to form an electrical connection with its corresponding solder bump.
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