US Patent No: 5,261,593

Number of patents in Portfolio can not be more than 2000

Direct application of unpackaged integrated circuit to flexible printed circuit

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ATTORNEY / AGENT: (SPONSORED)
 

Importance

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Abstract

A method is described for electrically connecting flip chips to a flexible printed circuit substrate. The method comprises (1) providing solder paste to a plurality of active contact pads located on the flexible printed circuit substrate, (2) placing the flip chips on the substrate such that solder bumps located on the flip chips are in registration with the solder paste on the active contact pads, and (3) heating the resulting assembly as a whole so that the solder paste on each active contact pad reflows to form an electrical connection with its corresponding solder bump.

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First Claim

Related Publications

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Patent Owner(s)

Patent OwnerAddressTotal Patents
MULTEK FLEXIBLE CIRCUITS, INC.NORTHFIELD, MN22

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Casson, Keith L Northfield, MN 6 380
Habeck, Kelly D Tampa, FL 2 194
Selbitschka, Eugene T South St. Paul, MN 3 215

Cited Art

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (4)
4,814,855 Balltape structure for tape automated bonding, multilayer packaging, universal chip interconnection and energy beam processes for manufacturing balltape 48 1986
4,967,950 Soldering method 66 1989
5,133,495 Method of bonding flexible circuit to circuitized substrate to provide electrical connection therebetween 93 1991
5,203,075 Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders 155 1991
 
AT&T BELL LABORATORIES (1)
5,021,630 Laser soldering method and apparatus 17 1990
 
DYPAX SYSTEMS CORPORATION (1)
4,748,495 High density multi-chip interconnection and cooling package 121 1985
 
HITACHI CHEMICAL COMPANY, LTD. (1)
5,001,542 Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips 125 1989
 
KABUSHIKI KAISHA TOSHIBA (1)
4,878,098 Semiconductor integrated circuit device 45 1989
 
KEY TRONIC CORPORATION (1)
4,774,634 Printed circuit board assembly 34 1986
 
MASSACHUSETTS INSTITUTE OF TECHNOLOGY (1)
4,980,034 High-density, multi-level interconnects, flex circuits, and tape for TAB 59 1989
 
MAXIM INTEGRATED PRODUCTS, INC. (1)
4,628,406 Method of packaging integrated circuit chips, and integrated circuit package 70 1985
 
MITSUI MINING & SMELTING CO., LTD. (1)
5,019,944 Mounting substrate and its production method, and printed wiring board having connector function and its connection method 83 1989
 
MIYACHI UNITEK CORPORATION (1)
5,033,665 Soldering system and method of using same 8 1990
 
MULTEK FLEXIBLE CIRCUITS, INC. (1)
5,112,462 Method of making metal-film laminate resistant to delamination 29 1990
 
NATIONAL SEMICONDUCTOR CORPORATION (1)
5,008,997 Gold/tin eutectic bonding for tape automated bonding process 29 1989
 
RADSTONE TECHNOLOGY PLC (1)
4,219,882 Magnetic domain devices 16 1978
 
SHARP KABUSHIKI KAISHA (1)
4,862,153 Flat display panel with framing for flexible substrate folding 70 1987
 
TEKTRONIX, INC. (1)
4,647,959 Integrated circuit package, and method of forming an integrated circuit package 37 1985
 
TOKYO SHIBAURA DENKI KABUSHIKI KAISHA (1)
4,425,401 Magnetic recording media 23 1982
 
UTMC MICROELECTRONIC SYSTEMS INC. (1)
4,772,936 Pretestable double-sided tab design 76 1987

Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
BRIDGE SEMICONDUCTOR CORPORATION (47)
6,537,851 Method of connecting a bumped compliant conductive trace to a semiconductor chip 3 2001
6,673,710 Method of connecting a conductive trace and an insulative base to a semiconductor chip 6 2001
6,667,229 Method of connecting a bumped compliant conductive trace and an insulative base to a semiconductor chip 3 2001
6,492,252 Method of connecting a bumped conductive trace to a semiconductor chip 20 2001
6,800,506 Method of making a bumped terminal in a laminated structure for a semiconductor chip assembly 4 2002
6,583,040 Method of making a pillar in a laminated structure for a semiconductor chip assembly 8 2002
6,740,576 Method of making a contact terminal with a plated metal peripheral sidewall portion for a semiconductor chip assembly 46 2002
6,608,374 Semiconductor chip assembly with bumped conductive trace 5 2002
7,264,991 Method of connecting a conductive trace to a semiconductor chip using conductive adhesive 5 2002
6,699,780 Method of connecting a conductive trace to a semiconductor chip using plasma undercut etching 6 2002
6,809,414 Semiconductor chip assembly with bumped conductive trace 5 2002
6,984,576 Method of connecting an additively and subtractively formed conductive trace and an insulative base to a semiconductor chip 2 2003
6,949,408 Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps 2 2003
6,908,788 Method of connecting a conductive trace to a semiconductor chip using a metal base 2 2003
6,872,591 Method of making a semiconductor chip assembly with a conductive trace and a substrate 8 2003
6,876,072 Semiconductor chip assembly with chip in substrate cavity 14 2003
7,190,080 Semiconductor chip assembly with embedded metal pillar 14 2003
7,094,676 Semiconductor chip assembly with embedded metal pillar 8 2003
7,009,297 Semiconductor chip assembly with embedded metal particle 13 2004
7,015,128 Method of making a semiconductor chip assembly with an embedded metal particle 9 2004
7,067,911 Three-dimensional stacked semiconductor package with metal pillar in encapsulant aperture 13 2004
7,129,113 Method of making a three-dimensional stacked semiconductor package with a metal pillar in an encapsulant aperture 11 2004
7,071,573 Semiconductor chip assembly with welded metal pillar 5 2004
7,132,741 Semiconductor chip assembly with carved bumped terminal 19 2004
7,129,575 Semiconductor chip assembly with bumped metal pillar 5 2004
7,112,521 Method of making a semiconductor chip assembly with a bumped metal pillar 2 2004
7,071,089 Method of making a semiconductor chip assembly with a carved bumped terminal 4 2004
7,319,265 Semiconductor chip assembly with precision-formed metal pillar 4 2005
7,075,186 Semiconductor chip assembly with interlocked contact terminal 5 2005
7,232,706 Method of making a semiconductor chip assembly with a precision-formed metal pillar 3 2005
7,232,707 Method of making a semiconductor chip assembly with an interlocked contact terminal 3 2005
7,414,319 Semiconductor chip assembly with metal containment wall and solder terminal 2 2005
7,419,851 Method of making a semiconductor chip assembly with a metal containment wall and a solder terminal 2 2005
7,268,421 Semiconductor chip assembly with welded metal pillar that includes enlarged ball bond 2 2006
7,262,082 Method of making a three-dimensional stacked semiconductor package with a metal pillar and a conductive interconnect in an encapsulant aperture 44 2006
7,993,983 Method of making a semiconductor chip assembly with chip and encapsulant grinding 1 2006
7,750,483 Semiconductor chip assembly with welded metal pillar and enlarged plated contact terminal 0 2006
7,446,419 Semiconductor chip assembly with welded metal pillar of stacked metal balls 1 2006
7,425,759 Semiconductor chip assembly with bumped terminal and filler 2 2006
7,396,703 Method of making a semiconductor chip assembly with a bumped terminal and a filler 2 2006
7,932,165 Method of making a semiconductor chip assembly with a laterally aligned filler and insulative base 0 2006
7,453,140 Semiconductor chip assembly with laterally aligned filler and insulative base 1 2006
7,417,314 Semiconductor chip assembly with laterally aligned bumped terminal and filler 3 2006
7,494,843 Method of making a semiconductor chip assembly with thermal conductor and encapsulant grinding 0 2006
7,538,415 Semiconductor chip assembly with bumped terminal, filler and insulative base 1 2007
7,833,827 Method of making a semiconductor chip assembly with a bumped terminal, a filler and an insulative base 1 2007
7,811,863 Method of making a semiconductor chip assembly with metal pillar and encapsulant grinding and heat sink attachment 0 2009
 
TESSERA, INC. (11)
5,802,699 Methods of assembling microelectronic assembly with socket for engaging bump leads 137 1994
5,632,631 Microelectronic contacts with asperities and methods of making same 152 1994
5,615,824 Soldering with resilient contacts 49 1995
5,812,378 Microelectronic connector for engaging bump leads 137 1995
5,980,270 Soldering with resilient contacts 64 1996
6,205,660 Method of making an electronic contact 62 1997
5,934,914 Microelectronic contacts with asperities and methods of making same 64 1997
5,983,492 Low profile socket for microelectronic components and method for making the same 46 1997
6,162,661 Spacer plate solder ball placement fixture and methods therefor 15 1998
6,229,100 Low profile socket for microelectronic components and method for making the same 28 1999
6,938,338 Method of making an electronic contact 1 2003
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (8)
5,831,828 Flexible circuit board and common heat spreader assembly 19 1993
5,759,269 Manufacturing flexible circuit board assemblies and printer for screening solder paste in such manufacture 25 1995
5,638,597 Manufacturing flexible circuit board assemblies with common heat spreaders 17 1995
5,960,251 Organic-metallic composite coating for copper surface protection 15 1996
5,729,440 Solder hierarchy for chip attachment to substrates 60 1997
5,969,945 Electronic package assembly 18 1997
6,753,612 Economical high density chip carrier 40 2001
6,998,290 Economical high density chip carrier 2 2003
 
FLIPCHIP INTERNATIONAL, LLC (5)
6,441,487 Chip scale package using large ductile solder balls 88 1997
6,287,893 Method for forming chip scale package 113 1998
7,057,292 Solder bar for high power flip chips 2 2000
6,578,755 Polymer collar for solder bumps 17 2000
6,750,135 Method for forming chip scale package 20 2001
 
FCI AMERICAS TECHNOLOGY LLC (4)
6,805,278 Self-centering connector with hold down 24 2000
6,791,845 Surface mounted electrical components 3 2002
7,535,723 Surface mounted electrical components and method for mounting and retaining same 3 2003
7,249,411 Methods for mounting surface-mounted electrical components 1 2004
 
INTEL CORPORATION (4)
5,660,321 Method for controlling solder bump height and volume for substrates containing both pad-on and pad-off via contacts 16 1996
6,020,561 Printed circuit substrate with solder formed on pad-on-via and pad-off-via contacts thereof 109 1996
6,644,536 Solder reflow with microwave energy 23 2001
7,199,342 Self-aligned mechanical joint between die and substrate exposed to mixed microwave energy 0 2003
 
ALTERA CORPORATION (3)
6,462,414 Integrated circuit package utilizing a conductive structure for interlocking a conductive ball to a ball pad 25 2000
6,929,978 Method of fabricating an integrated circuit package utilizing a conductive structure for improving the bond strength between an IC package and a printed circuit board 4 2002
7,446,399 Pad structures to improve board-level reliability of solder-on-pad BGA structures 2 2004
 
HONEYWELL INTERNATIONAL INC. (3)
6,246,014 Printed circuit assembly and method of manufacture therefor 17 1998
6,147,870 Printed circuit assembly having locally enhanced wiring density 6 1998
6,666,810 Device for controllable stretching of thin materials 0 2000
 
LIN, CHARLES W.C. (3)
6,437,452 Bumpless flip chip assembly with strips-in-via and plating 2 1999
6,319,751 Bumpless flip chip assembly with solder via 12 1999
6,316,830 Bumpless flip chip assembly with strips and via-fill 14 1999
 
AGILENT TECHNOLOGIES, INC. (2)
5,672,542 Method of making solder balls by contained paste deposition 67 1996
5,586,715 Method of making solder balls by contained paste deposition 39 1996
 
FLIPCHIP INTERNATIONAL (2)
5,547,740 Solderable contacts for flip chip integrated circuit devices 135 1995
5,607,099 Solder bump transfer device for flip chip integrated circuit devices 58 1995
 
HERTZ, ERIC L. (2)
6,202,918 Method and apparatus for placing conductive preforms 9 1997
6,230,963 Method and apparatus using colored foils for placing conductive preforms 8 1997
 
KPS SPECIAL SITUATIONS FUND II L.P. (2)
6,170,737 Solder ball placement method 5 1998
6,641,030 Method and apparatus for placing solder balls on a substrate 8 1999
 
MULTEK FLEXIBLE CIRCUITS, INC. (2)
5,719,749 Printed circuit assembly with fine pitch flexible printed circuit overlay mounted to printed circuit board 61 1994
5,615,477 Method for interconnecting a flip chip to a printed circuit substrate 155 1996
 
MURATA MANUFACTURING CO., LTD. (2)
6,598,779 Electronic component mounting method 1 2002
6,815,834 Electronic part 1 2003
 
SEIKO EPSON CORPORATION (2)
6,201,193 Printed circuit board having a positioning marks for mounting at least one electronic part 22 1999
6,335,563 Semiconductor device, method of fabricating the same, circuit board, and electronic device 11 1999
 
ADVANCED MICRO DEVICES, INC. (1)
6,527,164 Removing flux residue from reflow furnace using active gaseous solvent 0 2000
 
AMKOR TECHNOLOGY, INC. (1)
7,871,899 Methods of forming back side layers for thinned wafers 1 2007
 
AT&T BELL LABORATORIES (1)
5,346,118 Surface mount solder assembly of leadless integrated circuit packages to substrates 86 1993
 
AT&T IPM CORP. (1)
6,077,725 Method for assembling multichip modules 24 1992
 
CHARLES W.C. LIN. (1)
6,448,644 Flip chip assembly with via interconnection 18 1998
 
FREESCALE SEMICONDUCTOR, INC. (1)
5,738,269 Method for forming a solder bump 13 1996
 
HEWLETT-PACKARD COMPANY (1)
5,539,153 Method of bumping substrates by contained paste deposition 99 1994
 
HITACHI METALS, LTD. (1)
7,614,541 Method and apparatus for placing conductive balls 0 2008
 
HON HAI PRECISION INDUSTRY CO., LTD. (1)
6,424,037 Process to make a tall solder ball by placing a eutectic solder ball on top of a high lead solder ball 4 2001
 
MEGICA CORPORATION (1)
7,960,270 Method for fabricating circuit component 0 2007
 
MITSUBISHI ELECTRIC & ELECTRONICS USA, INC. (1)
6,576,493 Method of connecting a conductive trace and an insulative base to a semiconductor chip using multiple etch steps 12 2002
 
MOTOROLA, INC. (1)
5,553,538 Method and apparatus for stencil printing printed circuit boards 27 1995
 
NODA SCREEN CO., LTD. (1)
6,276,599 Method and apparatus for forming solder bumps 5 1999
 
ROBERT BOSCH GMBH (1)
6,226,183 Arrangement including a substrate for power components and a heat sink, and a method for manufacturing the arrangement 22 1999
 
SPEEDLINE, INC. (1)
6,056,190 Solder ball placement apparatus 22 1998
 
SPINESMITH PARTNERS, L.P. (1)
7,459,385 Method of making a semiconductor chip assembly with a laterally aligned bumped terminal and filler 2 2006
 
STMICROELECTRONICS N.V. (1)
6,036,836 Process to create metallic stand-offs on an electronic circuit 14 1997
 
TEXAS INSTRUMENTS INCORPORATED (1)
7,056,767 Method and apparatus for flip chip device assembly by radiant heating 2 2003
 
TYCO ELECTRONICS CORPORATION (1)
5,971,249 Method and apparatus for controlling a time/temperature profile inside of a reflow oven 16 1997
 
ULTRATECH, INC. (1)
5,872,051 Process for transferring material to semiconductor chip conductive pads using a transfer substrate 82 1995
 
UTAC HONG KONG LIMITED (1)
6,111,324 Integrated carrier ring/stiffener and method for manufacturing a flexible integrated circuit package 39 1998
 
VISTEON GLOBAL TECHNOLOGIES, INC. (1)
5,931,371 Standoff controlled interconnection 41 1997
 
OTHER [CHECK PATENT PROFILE FOR ASSIGNMENT INFORMATION] (25)
6,562,657 Semiconductor chip assembly with simultaneously electrolessly plated contact terminal and connection joint 9 2000
6,551,861 Method of making a semiconductor chip assembly by joining the chip to a support circuit with an adhesive 7 2000
6,402,970 Method of making a support circuit for a semiconductor chip assembly 10 2000
6,350,633 Semiconductor chip assembly with simultaneously electroplated contact terminal and connection joint 23 2000
6,350,386 Method of making a support circuit with a tapered through-hole for a semiconductor chip assembly 13 2000
6,350,632 Semiconductor chip assembly with ball bond connection joint 9 2000
6,448,108 Method of making a semiconductor chip assembly with a conductive trace subtractively formed before and after chip attachment 12 2000
6,440,835 Method of connecting a conductive trace to a semiconductor chip 20 2000
6,444,489 Semiconductor chip assembly with bumped molded substrate 16 2000
6,653,170 Semiconductor chip assembly with elongated wire ball bonded to chip and electrolessly plated to support circuit 32 2001
6,528,891 Bumpless flip chip assembly with solder via 17 2001
6,475,833 Bumpless flip chip assembly with strips and via-fill 5 2001
6,406,939 Flip chip assembly with via interconnection 16 2001
6,403,400 Bumpless flip chip assembly with strips-in-via and plating 7 2001
6,660,626 Semiconductor chip assembly with simultaneously electrolessly plated contact terminal and connection joint 13 2001
6,562,709 Semiconductor chip assembly with simultaneously electroplated contact terminal and connection joint 26 2001
6,511,865 Method for forming a ball bond connection joint on a conductive trace and conductive pad in a semiconductor chip assembly 6 2001
6,653,217 Method of connecting a conductive trace to a semiconductor chip 17 2001
6,544,813 Method of making a semiconductor chip assembly with a conductive trace subtractively formed before and after chip attachment 5 2001
6,436,734 Method of making a support circuit for a semiconductor chip assembly 6 2001
6,403,460 Method of making a semiconductor chip assembly 9 2001
6,548,393 Semiconductor chip assembly with hardened connection joint 5 2001
6,576,539 Semiconductor chip assembly with interlocked conductive trace 21 2001
6,627,824 Support circuit with a tapered through-hole for a semiconductor chip assembly 9 2001
6,653,742 Semiconductor chip assembly with interlocked conductive trace 4 2002