Printed wiring board shielded from electromagnetic wave
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United States of America Patent
Stats
-
Nov 16, 1993
Grant Date -
N/A
app pub date -
Oct 15, 1991
filing date -
Oct 15, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A printed wiring board shielded from electromagnetic wave radiation has a conductive circuit pattern formed on an insulating substrate, a first insulating layer disposed over the circuit pattern, a jumper wire formed over the first insulating layer and between connecting terminals of the conductive pattern, a second insulating layer covering the jumper wire and the first insulating layer, and an electromagnetic wave shielding layer disposed over the conductive pattern. The jumper wire is formed by printing using a conductive paste containing a conductive material such as silver, carbon or copper. The shield layer is formed by printing using a conductive metal resin paste such as copper. An overcoat layer is applied over the shield layer to protect the shield layer.
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Cited Art Landscape
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