Bump forming method
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United States of America Patent
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-
Nov 23, 1993
Grant Date -
N/A
app pub date -
Feb 14, 1992
filing date -
Feb 20, 1991
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
In order to minimize the size of an aluminum pad in a method of forming a bump, a metal wire is wedge-bonded on the aluminum pad, a necessary amount of the wire is left on the aluminum pad, and the metal wire is disconnected by a clamp. The width of a collapsed portion of the wire on the aluminum pad can be reduced to 1.5 times or less the wire diameter.
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