Method of forming a three-dimensional printed circuit assembly
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United States of America Patent
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Nov 23, 1993
Grant Date -
N/A
app pub date -
Oct 22, 1992
filing date -
Oct 22, 1992
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A three-dimensional printed circuit assembly is formed by first making a substrate (20). A substrate (20) is first formed from a photoactive polymer (14) that is capable of altering its physical state when exposed to a radiant beam (30). At this point, the substrate is only partially cured. A conductive circuit pattern (50) is then formed on the partially cured substrate. The substrate is then molded to create a three-dimensional structure, and then further cured to cause the photoactive polymer to harden.
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