Device for joining a two-dimensional compound workpiece
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United States of America Patent
Stats
-
Nov 23, 1993
Grant Date -
N/A
app pub date -
Apr 29, 1991
filing date -
May 9, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The device has a support plate (119) provided with drive means (112, 117) for at least one lower part, as well as a plurality of holding plates (85) arranged in one row with an upper receiving surface and a lower receiving surface (93, 94), respectively, for a plurality of upper parts. The holding plates (85) can be rotated through 180.degree. by means of a pivoting device (86, 87, 108) around a symmetrical horizontal axis (L3). After the upper parts have been placed on the holding plates (85), adhesive is applied to the edges of the upper parts, after which the holding plates (85) are pivoted through 180.degree.. The support plate (119) subsequently gathers the upper parts, which are now hanging down, while at the same time the next upper parts can be placed over the receiving surfaces of the holding plates (85), which [receiving surfaces] are now facing upward. The support plate (119) and the holding plates (85) are designed as suction plates that can be turned on and off.
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