Integrated circuit structure with heat exchanger elements secured thereto and method of making
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United States of America Patent
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Nov 30, 1993
Grant Date -
N/A
app pub date -
Sep 22, 1992
filing date -
Sep 22, 1992
priority date (Note) -
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status (Latency Note)
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Abstract
An integrated circuit structure and method of making in which the circuit has a plurality of metal heat exchanger elements spaced from each other with their first ends secured to the structure. The first ends may be adhesively secured to an integrated circuit chip or the underlying substrate, and the heat exchanger may be hermetically attached. The method uses a compliant removable support block for attaching the plurality of individual heat exchanger elements to integrated circuit structures having variations in their elevation.
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