Method of making a multilayer thin film structure

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United States of America Patent

PATENT NO 5266446
SERIAL NO

07890331

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method of making a multilayer thin film structure on the surface of a dielectric substrate which includes the steps of: a. forming a multilayer thin film structure including the steps of: applying a first layer of dielectric polymeric material on the surface of a dielectric substrate, applying a second layer of dielectric polymeric material over the first layer of polymeric material wherein the second polymeric material is photosensitive, imagewise exposing and developing the second polymeric material to form a feature therein, the second layer feature in communication with at least one feature formed in the first polymeric material; and b. filling the features in the entire multilayer structure simultaneously with conductive material. Preferably, the first layer feature is a via and the second layer feature is a capture pad or wiring channel. Also disclosed is a multilayer thin film structure made by this method.

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Patent Owner(s)

Patent OwnerAddress
INTERNATIONAL BUSINESS MACHINES CORPORATIONARMONK NY

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Kenneth Hopewell Junction, NY 15 349
Czornyj, George Poughkeepsie, NY 11 322
Farooq, Mukta S Hopewell Junction, NY 17 624
Kumar, Ananda H Hopewell Junction, NY 120 3509
Pitler, Marvin S late of Poughkeepsie, NY 1 108
Steimel, Heinz O Fishkill, NY 4 166

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