Flexible printed circuit board having a metal substrate
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 30, 1993
Grant Date -
N/A
app pub date -
Nov 27, 1991
filing date -
Nov 29, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A flexible circuit board including a flexible substrate having an insulating polyimide sheet and a wiring pattern portion formed in a mounting portion and a wiring pattern portion formed in a connecting portion, and a metal substrate on which only the mounting portion of the flexible substrate is secured by means of a thermoplastic polyimide film. Electronic devices are mounted on the mounting portion of the flexible substrate and heat generated by the electric devices can be effectively dissipated through the metal substrate. The connecting portion of the flexible substrate can be connected to an external circuit by means of a connector provided at an edge of the connecting portion. Since the connecting portion is not secured to the metal substrate, connector pins having a large mechanical strength can be used and the connecting portion can be bent at will.
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