Printed wiring board having through-holes covered with ink layer and method of manufacture thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 30, 1993
Grant Date -
N/A
app pub date -
Mar 15, 1991
filing date -
May 18, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A printed wiring board includes a substrate having an electrically conductive pattern disposed on at least one side of the substrate. An electrically conductive through-hole is formed in the substrate. At least one of a solder resist film and an electromagnetic shielding layer undercoat film are disposed over the conductive pattern but do not cover the electrically conductive through-hole. An ink layer is formed over at least one end of the electrically conductive through-hole. A method of manufacturing the printed wiring board embodied by the invention comprises providing a substrate having an electrically conductive through-hole. A conductive pattern is formed on at least one side of the substrate. At least one of a solder resist film and an electromagnetic shielding layer undercoat film are formed over the conductive pattern but not over the electrically conductive through-hole. An ink layer is formed over at least one end of the electrically conductive through-hole. The ink layer may be formed simultaneously with the printing of symbols of electronic parts to be mounted on the printed wiring board.
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Family
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Cited Art Landscape
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