Vertical-cavity surface emitting laser optical interconnect technology
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United States of America Patent
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Nov 30, 1993
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N/A
app pub date -
Jan 21, 1992
filing date -
Jan 21, 1992
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Abstract
A three-dimensional optical interconnection is disclosed having a stack of vertically aligned optoelectronic integrated (OEIC) modules. Each OEIC module includes an array of vertical cavity surface emitting lasers (VCSEL), receivers and electronic logic which are monolithically integrated on a single semiconductor substrate. Communication between the OEIC modules is effectuated by the free space propagation of laser radiation from the VCSELs to corresponding receivers on an adjacent OEIC module. Transistors, such as heterojunction bipolar transistors, may be used to drive the VCSELS.
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